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課程概述 |
電子構裝製程
Electronic Packaging
1. Overview of Electronic Packaging
2. Die Attachment
3. Interconnection (Wire Bonding, TAB, Flip Chip)
4. LCD Driving IC Packaging
5. Encapsulation
6. Ball Grid Array Package
7. Chip Scale Package
8. Packaging Materials
9. Soldering and Solders
10. Package Failure Analysrs and Reliability
11. Thermal Management
12. Electromagnetic Interference
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